Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764109 | Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via | Jochen Kraft, Georg Parteder, Stefan Jessenig, Jörg Siegert | 2023-09-19 |