Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778818 | Three-dimensional memory device with punch-through-resistant word lines and methods for forming the same | Ryo Mochizuki, Yasuo Kasagi, Junji Oh, Yujin Terasawa, Hiroaki Namba | 2023-10-03 |
| 11569139 | Electrical overlay measurement methods and structures for wafer-to-wafer bonding | Ikue Yokomizo, Kazuto Watanabe, Hajime Yamamoto, Takashi Yamaha, Koichi Ito +5 more | 2023-01-31 |