Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11812598 | Memory device including laterally perforated support pillar structures surrounding contact via structures and methods for forming the same | — | 2023-11-07 |
| 11569139 | Electrical overlay measurement methods and structures for wafer-to-wafer bonding | Ikue Yokomizo, Michiaki Sano, Hajime Yamamoto, Takashi Yamaha, Koichi Ito +5 more | 2023-01-31 |