Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569155 | Substrate bonding pad having a multi-surface trace interface | Cheng-Hsiung Yang | 2023-01-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569155 | Substrate bonding pad having a multi-surface trace interface | Cheng-Hsiung Yang | 2023-01-31 |