CY

Cheng-Hsiung Yang

WT Western Digital Technologies: 1 patents #269 of 737Top 40%
Overall (2023): #482,365 of 537,848Top 90%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11569155 Substrate bonding pad having a multi-surface trace interface Chih-Chin Liao 2023-01-31