Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11560495 | CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same | Won Jung Kim, Tae Won Park, Eui Rang LEE, Jong Won Lee, Youn-Jin Cho | 2023-01-24 |