Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11702537 | Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same | Sang Jin Kim, Sang Kyun Kim, Tae Shin EOM, Dong Hwan Lee, Young-Joon Lee | 2023-07-18 |
| 11655363 | Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same | Sang Jin Kim, Sang Kyun Kim, Tae Shin EOM, Dong Hwan Lee, Young-Joon Lee | 2023-05-23 |