Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11853677 | Generating integrated circuit placements using neural networks | Anna Darling Goldie, Azalia Mirhoseini, Ebrahim Songhori, Wenjie Jiang, Shen Wang +8 more | 2023-12-26 |
| 11827793 | Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor | Sundae KIM, Yeji YANG, Chaehyuk KO, Ieju KIM, Arum YU +2 more | 2023-11-28 |
| 11702537 | Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same | Sang Jin Kim, Sang Kyun Kim, Tae Shin EOM, Dong Hwan Lee, Yong Han CHO | 2023-07-18 |
| 11655363 | Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same | Sang Jin Kim, Sang Kyun Kim, Tae Shin EOM, Dong Hwan Lee, Yong Han CHO | 2023-05-23 |
| 11556690 | Generating integrated circuit placements using neural networks | Anna Darling Goldie, Azalia Mirhoseini, Ebrahim Songhori, Wenjie Jiang, Shen Wang +8 more | 2023-01-17 |