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Yeo-Hoon Yoon

Samsung: 1 patents #7,162 of 17,037Top 45%
📍 Yongin-si, KR: #1,315 of 2,785 inventorsTop 50%
Overall (2023): #197,666 of 537,848Top 40%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11810878 Wafer-level package including under bump metal layer Hyung-Sun Jang 2023-11-07