Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810878 | Wafer-level package including under bump metal layer | Yeo-Hoon Yoon | 2023-11-07 |
| 11789141 | Omnidirectional sensor fusion system and method and vehicle including the same | Hoon Hui Lee, Sang Bok Won, Bo Young Yun, Seul Ki Han, Ji Eun Won +1 more | 2023-10-17 |