Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776946 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Seungjin Cheon, Bubryong Lee, Junglae Jung | 2023-10-03 |
TK
Tea-Geon Kim
Overall (2023): #232,403 of 537,848Top 45%
1
Patents 2023