Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776946 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Junglae Jung | 2023-10-03 |
BL
Bubryong Lee
Overall (2023): #498,278 of 537,848Top 95%
1
Patents 2023