Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574892 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Hyun-Soo Chung | 2023-02-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574892 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Hyun-Soo Chung | 2023-02-07 |