Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574892 | Semiconductor package having pads with stepped structure | Hyun-Soo Chung, Tae Won Yoo | 2023-02-07 |
MC
Myung-Kee Chung
Overall (2023): #315,881 of 537,848Top 60%
1
Patents 2023