Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594505 | Semiconductor package substrate and method of manufacturing semiconductor package using the same | Dae Hee Lee, Hyun Chul Jung, Myeong-Ho Hong | 2023-02-28 |
TK
Tae Ho Ko
Overall (2023): #236,014 of 537,848Top 45%
1
Patents 2023