Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594505 | Semiconductor package substrate and method of manufacturing semiconductor package using the same | Tae Ho Ko, Dae Hee Lee, Myeong-Ho Hong | 2023-02-28 |
HJ
Hyun Chul Jung
Overall (2023): #418,052 of 537,848Top 80%
1
Patents 2023