Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784139 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Sangsu Ha | 2023-10-10 |
| 11640950 | Semiconductor chip and semiconductor package | Byungwook Kim, Ahram Kang | 2023-05-02 |