Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784139 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Seongwon Jeong | 2023-10-10 |
| 11749630 | Interconnect structure and semiconductor chip including the same | Byungwook Kim, Ayoung KIM, Haeseong Jeong | 2023-09-05 |