Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705376 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Hyun-Soo Chung, Chan-Ho Lee | 2023-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705376 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Hyun-Soo Chung, Chan-Ho Lee | 2023-07-18 |