Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705376 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Myeong-Soon Park, Hyun-Soo Chung | 2023-07-18 |
| 11677919 | Image processing method and apparatus | Jong-Ok Kim, Jun-sang Yoo | 2023-06-13 |
| 11646261 | Integrated circuits including multi-layer conducting lines | Tae Hyung Kim | 2023-05-09 |
| 11628834 | Hybrid electric vehicle and method of controlling the same to avoid collision thereof | Jin Kyeom Cho, Ji Hoon Kang, Yeon Bok Kim, Myung-Woo Kim, Tae Wook Park +1 more | 2023-04-18 |