Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791209 | Method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor device | Seung Heon Lee, Jaekang Koh, Tae-Jong Han | 2023-10-17 |
| 11764119 | Integrated circuit devices | Seungheon Lee, Jaekang Koh, Hyukwoo Kwon, Taejong Han | 2023-09-19 |
| 11581326 | Three-dimensional semiconductor memory device | Tae-Jong Han, Jaekang Koh, Su-Jong Kim, Seung Heon Lee | 2023-02-14 |