Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804393 | Wafer processing apparatus including equipment front end module (EFEM) and wafer processing method using the same | Jinhyuk Choi, Jonghwi Seo, Beomsoo Hwang | 2023-10-31 |