Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688667 | Semiconductor package including a pad pattern | — | 2023-06-27 |
| 11626370 | Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure | Chulyong Jang | 2023-04-11 |