Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824023 | Semiconductor chip and semiconductor package including the same | Wonkyun Kwon | 2023-11-21 |
| 11810837 | Semiconductor packages | — | 2023-11-07 |
| 11626370 | Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure | Keumhee Ma | 2023-04-11 |