Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791298 | Semiconductor package including plurality of semiconductor chips on common connection structure | Yun Tae Lee, Han KIM | 2023-10-17 |
| 11657968 | Multilayer capacitor and board having the same | Hyung Joon Kim | 2023-05-23 |