Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791298 | Semiconductor package including plurality of semiconductor chips on common connection structure | Yun Tae Lee, Jung Ho Shim | 2023-10-17 |
| 11742308 | Semiconductor package for reducing stress to redistribution via | Seok Hwan Kim, Kyung Ho Lee, Kyung Moon JUNG | 2023-08-29 |