Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677867 | Data structure for physical layer encapsulation | Alain Mourad, Sung-hee Hwang, Belkacem Mouhouche, Hak-Ju Lee | 2023-06-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677867 | Data structure for physical layer encapsulation | Alain Mourad, Sung-hee Hwang, Belkacem Mouhouche, Hak-Ju Lee | 2023-06-13 |