Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677867 | Data structure for physical layer encapsulation | Sung-hee Hwang, Daniel Ansorregui, Belkacem Mouhouche, Hak-Ju Lee | 2023-06-13 |
| 11552733 | Apparatus and method for transmitting and receiving data in communication system | Hong-sil Jeong, Sung-Ryul Yun, Hyun-Koo Yang, Se-ho Myung, Ismael Gutierrez | 2023-01-10 |