Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605570 | Reconstituted wafer including integrated circuit die mechanically interlocked with mold material | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bret W. Simon | 2023-03-14 |