Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637211 | Optically clear thermal spreader for status indication within an electronics package | Ross K. Wilcoxon, Reginald D. Bean, Russell C. Tawney | 2023-04-25 |
| 11621219 | Method and apparatus for through silicon die level interconnect | Reginald D. Bean | 2023-04-04 |
| 11605570 | Reconstituted wafer including integrated circuit die mechanically interlocked with mold material | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Jacob R. Mauermann | 2023-03-14 |