Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11691389 | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | Yuya HIRAYAMA, Kenichi Tomioka, Keisuke Kushida, Minoru Kakitani, Hiroshi Shimizu | 2023-07-04 |