Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11691389 | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | Takayo KITAJIMA, Kenichi Tomioka, Keisuke Kushida, Minoru Kakitani, Hiroshi Shimizu | 2023-07-04 |
| 11593151 | Information processing apparatus and semiconductor device | Tsutomu Nakaminato, Kenji Kuroishi | 2023-02-28 |
| 11546485 | Information processing apparatus and semiconductor device | Tsutomu Nakaminato, Kenji Kuroishi | 2023-01-03 |