Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694982 | Sidewall wetting barrier for conductive pillars | Wei Hu, Dongming He, Wen Yin, Zhe Guan | 2023-07-04 |
| 11557557 | Flip-chip flexible under bump metallization size | Yangyang SUN, Dongming He | 2023-01-17 |