Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721656 | Integrated device comprising pillar interconnect with cavity | Yujen CHEN, Hung-Yuan Hsu | 2023-08-08 |
| 11694982 | Sidewall wetting barrier for conductive pillars | Wei Hu, Wen Yin, Zhe Guan, Lily Zhao | 2023-07-04 |
| 11557557 | Flip-chip flexible under bump metallization size | Yangyang SUN, Lily Zhao | 2023-01-17 |