Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855043 | Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates | Ramin Farjadrad | 2023-12-26 |
| 11855124 | Vertically integrated device stack including system on chip and power management integrated circuit | Peng Zou | 2023-12-26 |
| 11671017 | Current balancing for voltage regulator units in field programmable arrays | Gang Ren, Peng Zou, Curtis R. McAllister | 2023-06-06 |
| 11658577 | Power management integrated circuit with a field programmable array of voltage regulators | Peng Zou, Gang Ren, Curtis R. McAllister | 2023-05-23 |