Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855043 | Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates | Syrus Ziai | 2023-12-26 |
| 11841815 | Chiplet gearbox for low-cost multi-chip module applications | — | 2023-12-12 |
| 11822369 | Efficient signaling scheme for high-speed ultra short reach interfaces | Paul Langner | 2023-11-21 |
| 11653090 | Intelligent distributed systems and methods for live traffic monitoring and optimization | — | 2023-05-16 |