Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670627 | Hybrid system including photonic and electronic integrated circuits and cooling plate | Ramakanth Alapati | 2023-06-06 |
| 11550108 | Quantum computing die assembly with thru-silicon vias | Matteo Staffaroni, Albert Wang, John E. Berg, Ramakanth Alapati | 2023-01-10 |