Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11550108 | Quantum computing die assembly with thru-silicon vias | Gabriel J. Mendoza, Albert Wang, John E. Berg, Ramakanth Alapati | 2023-01-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11550108 | Quantum computing die assembly with thru-silicon vias | Gabriel J. Mendoza, Albert Wang, John E. Berg, Ramakanth Alapati | 2023-01-10 |