Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769763 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-09-26 |
| 11637071 | Package structure including multiple dies surrounded by conductive element and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-04-25 |
| 11569210 | Package structure having a first connection circuit and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-01-31 |
| 11545423 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-01-03 |
| 11545424 | Package structure and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu | 2023-01-03 |