Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769763 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2023-09-26 |
| 11670611 | Semiconductor package comprising plurality of bumps and fabricating method | Shang-Yu Chang-Chien, Hung-Hsin Hsu | 2023-06-06 |
| 11637071 | Package structure including multiple dies surrounded by conductive element and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2023-04-25 |
| 11569210 | Package structure having a first connection circuit and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2023-01-31 |
| 11557533 | Package structure and manufacturing method thereof | Hung-Hsin Hsu | 2023-01-17 |
| 11545423 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2023-01-03 |
| 11545424 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2023-01-03 |