Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670611 | Semiconductor package comprising plurality of bumps and fabricating method | Hung-Hsin Hsu, Nan-Chun Lin | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670611 | Semiconductor package comprising plurality of bumps and fabricating method | Hung-Hsin Hsu, Nan-Chun Lin | 2023-06-06 |