Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715669 | Through silicon via and method of manufacturing the same | Shih-Ping Lee, Tse-Hsien Wu, Pin-Chieh Huang, Yeh-Yu Chiang | 2023-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715669 | Through silicon via and method of manufacturing the same | Shih-Ping Lee, Tse-Hsien Wu, Pin-Chieh Huang, Yeh-Yu Chiang | 2023-08-01 |