Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715669 | Through silicon via and method of manufacturing the same | Shih-Ping Lee, Tse-Hsien Wu, Yu-Hsiang Chien, Yeh-Yu Chiang | 2023-08-01 |
| 11551636 | Constrained rendering | Edward Buckley | 2023-01-10 |