Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842980 | Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip | Mathias Wendt, Pascal Porten | 2023-12-12 |
| 11694977 | Method for producing a connection between component parts | Sophia Huppmann, Michael Hoenle, Thorsten Wagner, Kurt Hingerl | 2023-07-04 |
| 11557691 | Method of manufacturing a semiconductor device and semiconductor device | Sophia Huppmann | 2023-01-17 |