Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842980 | Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip | Mathias Wendt, Simeon Katz | 2023-12-12 |