Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705370 | Semiconductor component having a compressive strain layer and method for producing the semiconductor component having a compressive strain layer | Benjamin Michaelis, Markus Broell, Franz Eberhard, Michael Huber, Wolfgang Schmid | 2023-07-18 |