Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705370 | Semiconductor component having a compressive strain layer and method for producing the semiconductor component having a compressive strain layer | Benjamin Michaelis, Markus Broell, Robert Walter, Michael Huber, Wolfgang Schmid | 2023-07-18 |
| 11631783 | Radiation-emitting semiconductor chip | Fabian Kopp, Attila Molnar, Bjoern Muermann | 2023-04-18 |