Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11685649 | Capping plate for panel scale packaging of MEMS products | John H. Hong, Tallis Young Chang, Bing Wen, Yaoling Pan, Kenji Nomura | 2023-06-27 |
| 11624657 | MEMS sensors and systems | John H. Hong, Bing Wen, Tallis Young Chang, Sean ANDREWS | 2023-04-11 |
| 11555744 | Readout circuits and methods | Bing Wen, John H. Hong, Tallis Young Chang, Seung-Tak Ryu | 2023-01-17 |