Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11845697 | Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body | Kyohei ATSUJI, Noboru Nishimura, Yuji Katsuda | 2023-12-19 |
| 11837488 | Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body | Katsuhiro Inoue, Yuji Katsuda | 2023-12-05 |
| 11830753 | Composite sintered body, semiconductor manufacturing apparatus member and method of producing composite sintered body | Keita Miyanishi, Kyohei ATSUJI, Hirofumi Yamaguchi, Soichiro Aoyagi | 2023-11-28 |
| 11548829 | Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device | Noboru Nishimura, Hirofumi Yamaguchi | 2023-01-10 |