Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830753 | Composite sintered body, semiconductor manufacturing apparatus member and method of producing composite sintered body | Keita Miyanishi, Kyohei ATSUJI, Asumi NAGAI, Hirofumi Yamaguchi | 2023-11-28 |
| 11613470 | SiC powder and method for manufacturing same, electrically heated honeycomb structure and method for manufacturing same | Takafumi KIMATA, Kisuke Yamamoto | 2023-03-28 |